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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Dual 4-Stage Binary Ripple Counter
High-Performance Silicon-Gate CMOS
The MC54/74HC393 is identical in pinout to the LS393. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device consists of two independent 4-bit binary ripple counters with parallel outputs from each counter stage. A / 256 counter can be obtained by cascading the two binary counters. Internal flip-flops are triggered by high-to-low transitions of the clock input. Reset for the counters is asynchronous and active-high. State changes of the Q outputs do not occur simultaneously because of internal ripple delays. Therefore, decoded output signals are subject to decoding spikes and should not be used as clocks or as strobes except when gated with the Clock of the HC393. * * * * * * Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 236 FETs or 59 Equivalent Gates
MC54/74HC393
J SUFFIX CERAMIC PACKAGE CASE 632-08
1
14
14 1
N SUFFIX PLASTIC PACKAGE CASE 646-06
14 1
D SUFFIX SOIC PACKAGE CASE 751A-03
ORDERING INFORMATION MC54HCXXXJ MC74HCXXXN MC74HCXXXD Ceramic Plastic SOIC
PIN ASSIGNMENT
CLOCK a 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC CLOCK b RESET b Q1b Q2b Q3b Q4b
LOGIC DIAGRAM
RESET a Q1a 3, 11 Q2a Q1 Q2 Q3 Q4 Q3a Q4a GND
CLOCK
1, 13
4, 10 BINARY COUNTER 5, 9 6, 8
RESET
2, 12
FUNCTION TABLE
PIN 14 = VCC PIN 7 = GND Inputs Clock X H L Reset H L L L L Outputs L No Change No Change No Change Advance to Next State
10/95
(c) Motorola, Inc. 1995
1
REV 6
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* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
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MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC54/74HC393
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
VOL
ICC
TA
VIH
VIL
Iin
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic or SOIC DIP) (Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Maximum Quiescent Supply Current (per Package)
Maximum Input Leakage Current
Maximum Low-Level Output Voltage
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| 20 A
Vin = VCC or GND Iout = 0 A
Vin = VCC or GND
Vin = VIH or VIL |Iout| |Iout|
Vin = VIH or VIL |Iout| |Iout|
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v
v
v
v
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
- 65 to + 150
- 0.5 to + 7.0
2 - 55 Min 2.0 Value
v 4.0 mA v 5.2 mA
v 4.0 mA v 5.2 mA
0 0 0
0
50
25
20
260 300
750 500
+ 125
1000 500 400
VCC
Max
6.0
VCC V
6.0
6.0
4.5 6.0
2.0 4.5 6.0
4.5 6.0
2.0 4.5 6.0
2.0 4.5 6.0
2.0 4.5 6.0
Unit
Unit
mW
mA
mA
mA
_C
_C
_C
ns
V
V
V
V
V
- 55 to 25_C
0.1
1.5 3.15 4.2
0.26 0.26
3.98 5.48
0.1 0.1 0.1
1.9 4.4 5.9
0.3 0.9 1.2
8
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
v 85_C v 125_C
High-Speed CMOS Logic Data DL129 -- Rev 6 1.0 1.5 3.15 4.2 0.33 0.33 3.84 5.34 0.1 0.1 0.1 1.9 4.4 5.9 0.3 0.9 1.2 80
v
1.0 1.5 3.15 4.2 0.40 0.40 3.70 5.20 0.1 0.1 0.1 1.9 4.4 5.9 0.3 0.9 1.2
160
v
Unit
A A V V V V
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NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). * Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
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AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Symbol tPLH, tPHL tPLH, tPHL tPLH, tPHL tPLH, tPHL tTLH, tTHL tPHL fmax Cin Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 3) Maximum Propagation Delay, Reset to any Q (Figures 2 and 3) Maximum Propagation Delay, Clock to Q4 (Figures 1 and 3) Maximum Propagation Delay, Clock to Q3 (Figures 1 and 3) Maximum Propagation Delay, Clock to Q2 (Figures 1 and 3) Maximum Propagation Delay, Clock to Q1 (Figures 1 and 3) Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 3) Parameter VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- - 55 to 25_C 165 33 28 290 58 49 240 48 41 190 38 32 120 24 20 5.4 27 32 10 75 15 13 Guaranteed Limit
High-Speed CMOS Logic Data DL129 -- Rev 6
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Symbol
CPD
trec
tr, tf
tw
tw
Power Dissipation Capacitance (Per Counter)*
Maximum Input Rise and Fall Times (Figure 1)
Minimum Pulse Width, Reset (Figure 2)
Minimum Pulse Width, Clock (Figure 1)
Minimum Recovery Time, Reset Inactive to Clock (Figure 2)
Parameter
3 VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 - 55 to 25_C Typical @ 25C, VCC = 5.0 V 1000 500 400 125 25 21 80 16 14 50 10 9 Guaranteed Limit 1000 500 400 155 31 26 100 20 17 205 41 35 365 73 62 300 60 51 240 48 41 150 30 26 4.4 22 26 65 13 11 10 95 19 16 40 1000 500 400 190 38 32 120 24 20 250 50 43 435 87 74 360 72 61 285 57 48 180 36 31 110 22 19 3.6 18 21 75 15 13 10
v 85_C v 125_C
v 85_C v 125_C
MC54/74HC393
MOTOROLA MHz Unit Unit pF pF ns ns ns ns ns ns ns ns ns ns
MC54/74HC393
PIN DESCRIPTIONS
INPUTS Clock (Pins 1, 13) Clock input. The internal flip-flops are toggled and the counter state advances on high-to-low transitions of the clock input. CONTROL INPUTS Reset (Pins 2, 12) Active-high, asynchronous reset. A separate reset is proQ1, Q2, Q3, Q4 (Pins 3, 4, 5, 6, 8, 9, 10, 11) Parallel binary outputs Q4 is the most significant bit. vided for each counter. A high at the Reset input prevents counting and forces all four outputs low.
OUTPUTS
SWITCHING WAVEFORMS
tf 90% 50% 10% tw 1/fmax tPLH tPHL Q 90% 50% 10% CLOCK tTLH tTHL Q tr VCC RESET GND tPHL 50% trec VCC 50% GND 50% GND tw VCC
CLOCK
Figure 1.
Figure 2. EXPANDED LOGIC DIAGRAM
CLOCK 1, 13 D CL* C Q Q 4, 10 Q2 C Q Q 3, 11 Q1
TEST POINT OUTPUT DEVICE UNDER TEST
* Includes all probe and jig capacitance
D
Figure 3. Test Circuit
C D Q Q 5, 9 Q3
C D
Q Q 6, 8 Q4
RESET
2, 12
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC393
TIMING DIAGRAM
0 CLOCK RESET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
Q1 Q2 Q3 Q4
COUNT SEQUENCE
Outputs Count 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Q4 L L L L L L L L H H H H H H H H Q3 L L L L H H H H L L L L H H H H Q2 L L H H L L H H L L H H L L H H Q1 L H L H L H L H L H L H L H L H
High-Speed CMOS Logic Data DL129 -- Rev 6
5
MOTOROLA
MC54/74HC393
OUTLINE DIMENSIONS
J SUFFIX CERAMIC DIP PACKAGE CASE 632-08 ISSUE Y
8
-A14
-B1 7
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMESNION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.245 0.280 0.155 0.200 0.015 0.020 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.94 6.23 7.11 3.94 5.08 0.39 0.50 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0 15 0.51 1.01
-TSEATING PLANE
K F G D 14 PL 0.25 (0.010) N
M
M
S
TA
J 14 PL 0.25 (0.010)
M
T
B
S
DIM A B C D F G J K L M N
N SUFFIX PLASTIC DIP PACKAGE CASE 646-06 ISSUE L
14 8
B
1 7
NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01
A F C N H G D
SEATING PLANE
L
J K M
-A-
14 8
D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F
-B-
1 7
P 7 PL
0.25 (0.010)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G C
R X 45
F
SEATING PLANE
D
14 PL
K
M
M B
S
J
0.25 (0.010)
T
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.75 8.55 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 7 0 0.228 0.244 0.010 0.019
MOTOROLA
6
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC393
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High-Speed CMOS Logic Data DL129 -- Rev 6
CODELINE
7
*MC54/74HC393/D*
MC54/74HC393/D MOTOROLA


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